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Multicore Fiber (MCF) Connectivity Assemblies
3 days 6 hours ago #3254
by Mrs Bella Tse
Multicore Fiber (MCF) Connectivity Assemblies was created by Mrs Bella Tse
With the rapid development of artificial intelligence (AI) technology, the demand for data processing and communication capacity has reached unprecedented scale. Especially in the fields of big data analytics, deep learning, and cloud computing, communication systems increasingly require high-speed, high-bandwidth solutions. Traditional single-mode fiber (SMF) faces limitations due to the nonlinear Shannon limit, capping its transmission capacity. Spatial Division Multiplexing (SDM) transmission technology represented by multi-core fiber (MCF) has been widely used in long-distance coherent transmission networks and short-distance optical access networks, significantly improving the overall transmission capacity of the network.
With the rapid development of artificial intelligence (AI) technology, the demand for data processing and communication capacity has reached unprecedented scale. Especially in the fields of big data analytics, deep learning, and cloud computing, communication systems increasingly require high-speed, high-bandwidth solutions. Traditional single-mode fiber (SMF) faces limitations due to the nonlinear Shannon limit, capping its transmission capacity. Spatial Division Multiplexing (SDM) transmission technology represented by multi-core fiber (MCF) has been widely used in long-distance coherent transmission networks and short-distance optical access networks, significantly improving the overall transmission capacity of the network.
However, the application of MCF requires solving a series of connectivity issues, such as the coupling of MCF-to-SCF, MCF-to-MCF. This necessitates the development of MCF fiber connectors, MCF-SCF conversion FI/FO devices, and other related components, while also ensuring compatibility and interoperability with existing technologies and commercial standards.
Multi-Core Fiber Fan-In/Fan-Out (FIFO)
How to connect MCF with SCF? The MCF Fan-in & Fan-out (FIFO) is a key component that enables efficient coupling between MCF and standard SCF. There are several technologies for implementing MCF FIFO: fused taper, fiber bundle, 3D waveguides, and space optics technology.
Fused taper technology is one of the earliest applied techniques, where the coating of multiple single-core fibers is stripped, and the fibers are arranged and fused at high temperatures. The fibers are then drawn and tapered to match the outer diameter of the MCF (typically 125um). Tapered-fiber FIFOs are typically featured by a low IL, while the processing technology restricts their core counts. The packaging size of the component is large.
Fiber bundle technology involves etching or processing multiple single-core fibers to match the core diameter of MCF, ultimately forming the FIFO. Fiber bundle-type FIFOs are characterized by low insertion loss and crosstalk, though the processing technology also limits their core counts.
3D waveguide technology is written directly on platforms such as glass, polymers, planar optical waveguides, silicon-based or silicon nitride, transmitting light from MCF to single-core fibers through different waveguides. The key process is the writing of 3D waveguide chips. Once solved, it will be easy to realize mass production of FIFO devices.
Optical components such as lenses, prisms, and adjustment mounts are used to adjust and optimize the coupling between MCF and multiple single-core fibers through precise optical path design. Free space optical technology features low insertion loss and low crosstalk, but relies on precise control of component alignment and mature optical design capabilities.
Each of these methods has its advantages and is suitable for different application scenarios.
Multi-core Fiber Connectors
How to connect MCFs to MCFs? Most fiber connectors in the industry are designed for traditional single-core fibers, and MCFs are typically joined through fusion splicing. However, on-site fusion splicing can be challenging due to the varying core spacings between MCF fibers, making precise alignment difficult. Additionally, the lack of a standardized production process for multi-core fibers results in differences in core arrangement, size, and pitch across manufacturers, further complicating the fusion splicing of MCFs.
Based on this background, HYC has developed a range of MCF fiber connectors for MCF applications, including LC-type, FC-type, and MC-type connectors. The LC-type and FC-type MCF connectors are modified and designed based on the traditional LC/FC connector, with optimized positioning and maintaining functions and enhanced grinding and coupling processes, ensuring minimal insertion loss variation after many times coupling. The MC-type MCF connectors, independently developed by HYC, is more compact than traditional connectors, making it ideal for high-density applications.
MCF Hybrid subassemblies used for MC-EDFA system
To achieve high-capacity, high-speed, and long-distance transmission in spatial division multiplexing (SDM) systems, optical amplifiers are crucial for compensating transmission losses. SDM fiber amplifiers are crucial for the practical application of SDM technology, and multi-core erbium-doped fiber amplifiers (MC-EDFA) are key components of SDM transmission systems.
A typical EDFA system consists of erbium-doped fibers (EDF), pump light sources, couplers, isolators, and optical filters. To efficiently enable conversion between MCF and single-core fibers in MC-EDFA, FIFOs are commonly used. For future MC-EDFA systems, integrating the MCF-to-SCF conversion function into related optical components, such as 980/1550nm WDM, Gain Flattening Filters (GFF), can simplify system architecture and enhance overall link performance.
HYC offers a range of MCF hybrid components, including:
1. MCF isolator + TAP
2. MCF 980/1550nm WDM
3. MCF GFF
These hybrid components can be widely used in MC-EDFA amplifier systems, and HYC offers in-depth collaboration with customers during the design-in phase to provide one-stop custom solutions. With the continuous development of SDM technology, MCF Hybrid will offer more efficient and low-loss solutions for future ultra-high-capacity optical communication systems.
About HYC Co., Ltd
Founded in 2000, HYC is a leading global manufacturer of innovative and reliable passive optical components. HYC designs, develops, manufactures, and sells a comprehensive line of passive optical devices that enables 5G/6G, data center, data communication, AI, FTTH networks.
With the rapid development of artificial intelligence (AI) technology, the demand for data processing and communication capacity has reached unprecedented scale. Especially in the fields of big data analytics, deep learning, and cloud computing, communication systems increasingly require high-speed, high-bandwidth solutions. Traditional single-mode fiber (SMF) faces limitations due to the nonlinear Shannon limit, capping its transmission capacity. Spatial Division Multiplexing (SDM) transmission technology represented by multi-core fiber (MCF) has been widely used in long-distance coherent transmission networks and short-distance optical access networks, significantly improving the overall transmission capacity of the network.
However, the application of MCF requires solving a series of connectivity issues, such as the coupling of MCF-to-SCF, MCF-to-MCF. This necessitates the development of MCF fiber connectors, MCF-SCF conversion FI/FO devices, and other related components, while also ensuring compatibility and interoperability with existing technologies and commercial standards.
Multi-Core Fiber Fan-In/Fan-Out (FIFO)
How to connect MCF with SCF? The MCF Fan-in & Fan-out (FIFO) is a key component that enables efficient coupling between MCF and standard SCF. There are several technologies for implementing MCF FIFO: fused taper, fiber bundle, 3D waveguides, and space optics technology.
Fused taper technology is one of the earliest applied techniques, where the coating of multiple single-core fibers is stripped, and the fibers are arranged and fused at high temperatures. The fibers are then drawn and tapered to match the outer diameter of the MCF (typically 125um). Tapered-fiber FIFOs are typically featured by a low IL, while the processing technology restricts their core counts. The packaging size of the component is large.
Fiber bundle technology involves etching or processing multiple single-core fibers to match the core diameter of MCF, ultimately forming the FIFO. Fiber bundle-type FIFOs are characterized by low insertion loss and crosstalk, though the processing technology also limits their core counts.
3D waveguide technology is written directly on platforms such as glass, polymers, planar optical waveguides, silicon-based or silicon nitride, transmitting light from MCF to single-core fibers through different waveguides. The key process is the writing of 3D waveguide chips. Once solved, it will be easy to realize mass production of FIFO devices.
Optical components such as lenses, prisms, and adjustment mounts are used to adjust and optimize the coupling between MCF and multiple single-core fibers through precise optical path design. Free space optical technology features low insertion loss and low crosstalk, but relies on precise control of component alignment and mature optical design capabilities.
Each of these methods has its advantages and is suitable for different application scenarios.
Multi-core Fiber Connectors
How to connect MCFs to MCFs? Most fiber connectors in the industry are designed for traditional single-core fibers, and MCFs are typically joined through fusion splicing. However, on-site fusion splicing can be challenging due to the varying core spacings between MCF fibers, making precise alignment difficult. Additionally, the lack of a standardized production process for multi-core fibers results in differences in core arrangement, size, and pitch across manufacturers, further complicating the fusion splicing of MCFs.
Based on this background, HYC has developed a range of MCF fiber connectors for MCF applications, including LC-type, FC-type, and MC-type connectors. The LC-type and FC-type MCF connectors are modified and designed based on the traditional LC/FC connector, with optimized positioning and maintaining functions and enhanced grinding and coupling processes, ensuring minimal insertion loss variation after many times coupling. The MC-type MCF connectors, independently developed by HYC, is more compact than traditional connectors, making it ideal for high-density applications.
MCF Hybrid subassemblies used for MC-EDFA system
To achieve high-capacity, high-speed, and long-distance transmission in spatial division multiplexing (SDM) systems, optical amplifiers are crucial for compensating transmission losses. SDM fiber amplifiers are crucial for the practical application of SDM technology, and multi-core erbium-doped fiber amplifiers (MC-EDFA) are key components of SDM transmission systems.
A typical EDFA system consists of erbium-doped fibers (EDF), pump light sources, couplers, isolators, and optical filters. To efficiently enable conversion between MCF and single-core fibers in MC-EDFA, FIFOs are commonly used. For future MC-EDFA systems, integrating the MCF-to-SCF conversion function into related optical components, such as 980/1550nm WDM, Gain Flattening Filters (GFF), can simplify system architecture and enhance overall link performance.
HYC offers a range of MCF hybrid components, including:
1. MCF isolator + TAP
2. MCF 980/1550nm WDM
3. MCF GFF
These hybrid components can be widely used in MC-EDFA amplifier systems, and HYC offers in-depth collaboration with customers during the design-in phase to provide one-stop custom solutions. With the continuous development of SDM technology, MCF Hybrid will offer more efficient and low-loss solutions for future ultra-high-capacity optical communication systems.
About HYC Co., Ltd
Founded in 2000, HYC is a leading global manufacturer of innovative and reliable passive optical components. HYC designs, develops, manufactures, and sells a comprehensive line of passive optical devices that enables 5G/6G, data center, data communication, AI, FTTH networks.
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